Applications
Aeon is a high-performance, table-top batch plasma cleaning system which has been designed to deliver consistent results in a manufacturing environment.In manufacturing is typically used for:
- Plasma cleaning before wire-bonding on modules
- Plasma cleaning before transfer molding on modules
- Plasma cleaning before under-fill
- Plasma cleaning on PCBs, BGA substrates
Given its simple shelves design, it can also be used effectively for laboratory applications such as:
- Plasma cleaning of generic parts for surface cleaning and activation for organic contamination removal
- Plasma cleaning before coating processes (PVD, CVD, electroplating, Atomic Layer Deposition (ALD), dip coating, spin coating...)
- Plasma cleaning before paint application
- Plasma activation and functionalization of plastic materials (PE, PP, PDMS...)
- Thin-layer oxide removal on metal parts
Aeon's versatility extends to a wide range of applications within the Semiconductors, Automotive and Electronics industries.
Specifications
Machine Type
Table-Top Batch Plasma System
Footprint
670W x 948L x 812H mm
Plasma chamber configuration
4 shelves with 4 couples of powered electrode and ground electrode
Max product size
350W x 325L x 217H mm
Min product size
N/A
Plasma generator
300W RF Generator 13.56 MHz
Automatic tuning system
Gas lines
2 Process gas lines with Mass Flow Controller
Pumping system
Dry vacuum pump 250 L/min
Controller
Win10 LTSC PC with fieldbus 16" Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Certifications
CE S2 S8 Cleanroom ISO7 (10k)
Options
Purge line
600 W RF Generator
600 L/min dry vacuum pump (external)
Kit for using pure hydrogen and hydrogen generator
Compare SCI Systems
Category
Batch
Batch
Batch
Machine Type
Table-Top Batch Plasma System
Standalone batch plasma cleaner for bulky products or plasma desmearing system
Batch Plasma System
Footprint
670W x 948L x 812H mm
1503W x 1820L x 2101H mm
905W x 1155L x 1988H mm
Plasma Chamber Configuration
4 shelves with 4 couples of powered electrode and ground electrode
4 shelves with 4 couples of powered electrode and ground electrode
OR
4 holders for PCB desmearing
4 shelves with 4 couples of powered electrode and ground electrode
Max product size
350W x 325L x 217H mm
500W X 520L X 625H mm
393W x 354L x 382H mm
Min product size
N/A
N/A
N/A
Plasma generator
300W RF Generator 13.56 MHz
Automatic tuning system
600W RF Generator 13.56 MHz
Automatic tuning system or
5kW generator at 40 kHz
600W RF Generator 13.56 MHz
Automatic tuning system
Gas lines
2 Process gas lines with Mass Flow Controller
2 Process gas lines with Mass Flow Controller
1 Purge line
2 Process gas lines with Mass Flow Controller
1 Purge line
Pumping system
Dry vacuum pump 250 L/min
Dry vacuum pump 1670 L/min or
Dry vacuum pump 1830 L/min plus booster pump at 8400 L/min
Dry vacuum pump 1000 L/min
Controller
Win10 LTSC PC with fieldbus 16" Touchscreen
Proprietary SCI software
Win10 LTSC PC with fieldbus 21" Touchscreen
Proprietary SCI software
Win10 LTSC PC with fieldbus 21" Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Single phase 110-240V 50/60 Hz
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 40 mm OD
Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Certifications
CE S2 S8 Cleanroom ISO7 (10k)
CE S2 S8 Cleanroom ISO7 (10k)
CE S2 S8 Cleanroom ISO7 (10k)
Options
Purge line
600 W RF Generator
600 L/min dry vacuum pump (external)
Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 5000 L/min
Kit for using pure hydrogen and hydrogen generator
Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 1670 L/min