Applications
Ares is a high power system designed to treat large flat substrates for processes that may require high power and long plasma times.
Ares can be used for all the standard plasma cleaning and activation applications, such as:
- Plasma cleaning before wire-bonding
- Plasma cleaning before transfer molding
- Plasma cleaning before under-fill
- Plasma cleaning on PCBs, BGA substrates
- Plasma etching on various organic surfaces
- Polymer cross-linking applications
- Oxide removal on metal parts with oxide thickness in the micrometer region
Ares serves a specific range of applications within the Semiconductors, Automotive and Electronics industries where continuous high-power delivery is necessary.
Specifications
Machine Type
Large Surface Batch Plasma System
Footprint
1138W x 1811L x 1469H mm
Plasma chamber configuration
1 large holder
Max product size
420W X 430L X 40H mm
Min product size
N/A
Plasma generator
600W RF Generator 13.56 MHz
Automatic tuning system
Gas lines
2 Process gas lines with Mass Flow Controller
1 Purge line
Pumping system
Dry vacuum pump 1000 L/min
Controller
Win10 LTSC PC with fieldbus 21" Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Certifications
CE S2 S8 Cleanroom ISO7 (10k)
Options
Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 1670 L/min
Compare SCI Systems
Category
High power
High power
Machine Type
Large Surface Batch Plasma System
High Power - Batch Plasma System
Footprint
1138W x 1811L x 1469H mm
575W x 936L x 862H mm
Plasma Chamber Configuration
1 large holder
1 powered electrode and 1 ground electrode, multiple height positions
Max product size
420W X 430L X 40H mm
294W x 327L X 84H mm
Min product size
N/A
N/A
Plasma generator
600W RF Generator 13.56 MHz
Automatic tuning system
600W RF Generator 13.56 MHz
Automatic tuning system
Gas lines
2 Process gas lines with Mass Flow Controller
1 Purge line
2 Process gas lines with Mass Flow Controller
Pumping system
Dry vacuum pump 1000 L/min
Dry vacuum pump 250 L/min
Controller
Win10 LTSC PC with fieldbus 21" Touchscreen
Proprietary SCI software
Win10 LTSC PC with fieldbus 16" Touchscreen
Proprietary SCI software
Facilities
Single phase 110-240V 50/60 Hz
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Single phase 110-240V 50/60 Hz, 2.5KVA
CDA 5 to 6 bar
Process gas pressure 0.5 to 1.5 bar
Exhaust port 25 mm OD
Certifications
CE S2 S8 Cleanroom ISO7 (10k)
CE S2 S8 Cleanroom ISO7 (10k)
Options
Kit for using pure hydrogen and hydrogen generator
Dry vacuum pump 1670 L/min
Purge line
600 L/min dry vacuum pump
Kit for using pure hydrogen and hydrogen generator